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ST0274 Cadmium Sulfide Sputtering Target, CdS

Chemical Formula: CdS
Catalog Number: ST0274
CAS Number: 1306-23-6
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cadmium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cadmium Sulfide Sputtering Target Description

Cadmium sulfide sputtering target is a ceramic sputtering material composed of cadmium and sulfur, with the chemical formula CdS. This target is widely used in various applications due to its unique properties, including its use in thin film deposition processes. Cadmium sulfide is known for its photoconductive and semiconducting properties, making it suitable for use in photodetectors, solar cells, and other optoelectronic devices.

CadmiumCadmium is a chemical element named after the Latin term for the mineral calamine, ‘cadmia.’ It was first identified in 1817 by scientists S. L. Hermann, F. Stromeyer, and J.C.H. Roloff, who also successfully isolated the element. Represented by the symbol “Cd,” cadmium has an atomic number of 48 and is located in Period 5 and Group 12 of the periodic table, classified under the d-block elements. The element has a relative atomic mass of 112.411(8) Dalton, with the value in brackets indicating the measurement’s uncertainty.

Related Product: Cadmium Sputtering Target

SulfurSulfur, also spelled sulphur, is a chemical element with a rich history, originating from the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to sulfur. This element has been known and utilized since before 2000 BC, with early uses documented by Chinese and Indian civilizations. The chemical symbol for sulfur is “S,” and it holds the atomic number 16 on the periodic table, positioned in Period 3 and Group 16, within the p-block. Sulfur’s relative atomic mass is 32.065(5) Dalton, where the figure in brackets denotes the uncertainty in its measurement.

Cadmium Sulfide Sputtering Target Specification

Compound FormulaCdS
AppearanceYellow-orange Solid
Density4.82 g/cm3
Melting Point1750 °C
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Cadmium Sulfide Sputtering Target Application

The cadmium sulfide sputtering target is primarily used in thin film deposition applications across various industries. It is utilized in the creation of decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. Additionally, this material serves functional coating purposes in the optical information storage industry, as well as in glass coatings for automotive and architectural glass. Its properties also make it valuable in optical communication technologies.

Cadmium Sulfide Sputtering Target Packing

Our cadmium sulfide sputter targets are meticulously tagged and labeled externally to guarantee efficient identification and quality control. We take extensive measures to prevent any potential damage during storage or transportation, ensuring the product arrives in pristine condition.

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TFM offers Cadmium Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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