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ST0009 Chromium Sputtering Target, Cr

Chemical Formula: Cr
Catalog Number: ST0009
CAS Number: 7440-47-3
Purity: 99.9%, 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

 

MSDS File

Availability: 1 in stock

Chromium Sputtering Target Description

Chromium

Chromium sputtering targets possess the same properties as metallic chromium (Cr). Chromium is a steely-grey, lustrous, hard, and brittle transition metal that can be highly polished and resists tarnishing. It reflects nearly 70% of the visible spectrum and about 90% of infrared light. Known for its high corrosion resistance and hardness, chromium is crucial in producing stainless steel, which is resistant to corrosion and discoloration. Chromium sputtering targets are widely used in the aerospace, automotive lighting, OLED, and optical industries

Chromium Sputtering Target Specification

Material TypeChromium
SymbolCr
Automatic Number24
Color/AppearanceSilvery, Metallic, Solid State
Melting Point1,857°C
Theoretical Density7.2 g/cc
SputterDC
Type of BondIndium, Elastomer
CommentsFilms very adherent. High rates possible.
Target Dimensions & ThicknessDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Chromium Sputtering Target Application

Chromium sputtering targets are used in various vacuum applications, including automotive glass coatings, photovoltaic cell fabrication, battery fabrication, fuel cells, and decorative and corrosion-resistant coatings. They are also employed in CD-ROM production, thin film deposition decoration, flat panel displays, functional coatings, and the optical information storage industry.

Chromium Sputtering Target Bonding

Specialized bonding services for Chromium Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

 

Chromium Sputtering Target Packaging

Our Chromium Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Chromium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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