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Copper Aluminum Sputtering Target

ST0083 Copper Aluminum Sputtering Target, Cu/Al

Chemical Formula: Cu/Al
Catalog Number: ST0083
CAS Number: 7440-50-8 | 7429
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Copper Aluminum Sputtering Target Description

AluminumCopper

The copper-aluminum sputtering target from TFM is crafted from high-quality copper-aluminum alloys. These alloys are highly valued for their superior strength and corrosion resistance compared to other bronze alloys. They are tarnish-resistant and exhibit low corrosion rates in atmospheric conditions, low oxidation rates at high temperatures, and low reactivity with sulfurous compounds and other combustion exhaust products. Additionally, they are resistant to seawater corrosion. The corrosion resistance of copper-aluminum alloys is due to the aluminum content, which reacts with atmospheric oxygen to form a thin, tough layer of alumina (aluminum oxide) on the surface, effectively acting as a barrier against corrosion of the copper-rich alloy.

Related Product: Copper Sputtering Target, Aluminum Sputtering Target

Copper Aluminum Sputtering Target Packaging

Our Copper Aluminum Sputtering Targets are meticulously handled to prevent any damage during storage and transportation. This careful handling ensures that our products maintain their original quality and arrive in perfect condition.

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TFM offers Copper Aluminum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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