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VD0619 Copper Chrome Evaporation Materials, Cu/Cr

Catalog No.VD0619
MaterialCopper Chrome (Cu/Cr)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM specializes in manufacturing high-purity copper chrome evaporation materials, employing rigorous quality assurance processes to ensure consistent product reliability. We offer a variety of shapes, including tablets, granules, pellets, and powder, to meet diverse application needs.

MSDS File
Copper Chrome Evaporation Materials Description

TFM specializes in producing high-purity copper chrome evaporation materials, an alloy containing copper (Cu) and chromium (Cr) that is essential in achieving high-quality deposited films in various deposition processes. Our materials, with purity levels reaching up to 99.9995%, are manufactured using stringent quality assurance protocols, ensuring consistent product performance and reliability.

Related Products: Copper Evaporation Materials, Chrome Evaporation Materials

Copper Chrome Evaporation Materials Application

Copper chrome evaporation materials are utilized in a range of advanced applications, including:

  • Deposition Processes: Integral in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD) techniques, ensuring the production of high-quality films.
  • Optical Applications: Used for enhancing wear protection, creating decorative coatings, and improving display technologies.

Copper Chrome Evaporation Materials Packaging

Our copper chrome evaporation materials are meticulously packaged to prevent any damage during storage or transportation, preserving their quality and ensuring they remain in optimal condition upon delivery.

Contact TFM

TFM is a premier manufacturer and supplier of high-purity copper chrome evaporation materials, offering a broad selection of evaporation pellets in both powder and granule forms. We also provide customized solutions to meet specific requirements. For current pricing and inquiries about our evaporation materials or other deposition products not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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