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Copper Cobalt Evaporation Materials

VD0620 Copper Cobalt Evaporation Materials, Cu/Co

Catalog No.VD0620
MaterialCopper Cobalt (Cu/Co)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM specializes in the production of high-purity copper cobalt evaporation materials, employing stringent quality assurance processes to ensure exceptional product reliability. We offer these materials in various forms, including tablets, granules, pellets, and powder, to accommodate a wide range of application needs.

MSDS File
Copper Cobalt Evaporation Materials Overview

At TFM, we specialize in producing top-tier copper cobalt evaporation materials, a crucial alloy made from copper (Cu) and cobalt (Co). These materials play a significant role in deposition processes, contributing to the formation of high-quality films. Our copper cobalt evaporation materials feature an exceptional purity level of up to 99.9995%, ensuring unmatched reliability through our stringent quality control procedures.

Related Products: Copper Evaporation Materials, Cobalt Evaporation Materials

Applications of Copper Cobalt Evaporation Materials

Copper cobalt evaporation materials are integral to several advanced applications, including:

  • Deposition Processes: These materials are essential for semiconductor deposition, as well as chemical vapor deposition (CVD) and physical vapor deposition (PVD), enabling the production of films with precise and superior characteristics.
  • Optical Uses: They are also applied in enhancing wear resistance, creating decorative coatings, and advancing display technology.

Packaging of Copper Cobalt Evaporation Materials

We ensure that our copper cobalt evaporation materials are carefully packaged to prevent any potential damage during storage or transit. This attention to detail guarantees that the products maintain their superior quality and arrive in optimal condition.

Reach Out to TFM

As a leading manufacturer and supplier of high-purity copper cobalt evaporation materials, TFM offers a wide range of evaporation pellets available in both powder and granule forms. We also offer customized solutions to meet specific requirements. For up-to-date pricing and inquiries about our evaporation materials or other deposition products not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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