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Hafnium Oxide with Calcium Oxide Sputtering Target

ST0514 Hafnium Oxide with Calcium Oxide Sputtering Target, HfO2/CaO

Chemical Formula: HfO2/CaO
Catalog Number: ST0514
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Hafnium Oxide with Calcium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Hafnium Oxide with Calcium Oxide Sputtering Target Description

Hafnium

Hafnium is a lustrous, silvery gray, tetravalent transition metal, hafnium chemically resembles zirconium and is found in many zirconium minerals. Its existence was predicted by Dmitri Mendeleev in 1869, though it was not identified until 1923, by Coster and Hevesy, making it the last stable element to be discovered. Hafnium is named after Hafnia, the Latin name for Copenhagen, where it was discovered.

CalciumCalcium is a chemical element that originated from the Latin ‘calx’ meaning lime. It was first mentioned in 1808 and observed by H. Davy. The isolation was later accomplished and announced by H. Davy. “Ca” is the canonical chemical symbol of calcium. Its atomic number in the periodic table of elements is 20 with location at Period 4 and Group 2, belonging to the s-block. The relative atomic mass of calcium is 40.078(4) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Hafnium Sputtering Target, Calcium Sputtering Target.

Hafnium Oxide with Calcium Oxide Sputtering Target Specifications

Material TypeHafnium Oxide with Calcium Oxide
SymbolHfO2/CaO
Color/AppearanceSolid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Hafnium Oxide with Calcium Oxide Sputtering Target Applications

Semiconductor Devices: Used to deposit hafnium oxide films, which act as high-k dielectrics in advanced semiconductor devices, enhancing performance and enabling miniaturization.

Memory Devices: Essential in the production of non-volatile memory devices like Ferroelectric RAM (FeRAM) and Phase-Change Memory (PCM), improving data retention and reliability.

Optical Coatings: Applied in high-performance anti-reflective coatings for lenses, optical filters, and precision optics, reducing reflection and improving light transmission.

Ferroelectric Materials: Utilized in electronic components such as capacitors and sensors due to their high dielectric constant and ferroelectric properties.

Gas Sensors: Hafnium oxide-based films are used for detecting and monitoring gases in industrial and environmental applications.

Energy Storage: Explored for use in supercapacitors and batteries, offering high energy density and charge storage capabilities.

Thin-Film Transistors (TFTs): Employed in the fabrication of TFTs, critical for flat-panel displays, including LCDs and OLEDs.

Nanotechnology: Used in nanoscale applications like nanowire fabrication and the development of novel nanoelectronic devices.

Hafnium Oxide with Calcium Oxide Sputtering Target Packing

Our Hafnium Oxide with Calcium Oxide Sputtering Targets are clearly tagged and labeled for efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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