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ST0150 Holmium Oxide Sputtering Target, Ho2O3

Chemical Formula: Ho2O3
Catalog Number: ST0150
CAS Number: 12055-62-8
Purity: 99.9%, 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Holmium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Holmium Oxide Sputtering Target Description

The Holmium Oxide Sputtering Target from TFM is an oxide sputtering material composed of holmium (Ho) and oxygen (O).

HolmiumHolmium is a chemical element named after Stockholm, Sweden, with its Latin name being Holmia. It was first mentioned in 1878 and observed by M. Delafontaine. The chemical symbol for holmium is “Ho,” and its atomic number is 67. It is located in Period 6, Group 3 of the periodic table, within the f-block. The relative atomic mass of holmium is 164.93032(2) Dalton, with the number in brackets indicating the measurement uncertainty. Holmium is one of the rare earth elements, known for its strong magnetic properties. It is used in various applications, including magnets, lasers, and as a neutron absorber in nuclear reactors.

Related Product: Holmium Sputter Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and it has an atomic number of 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in parentheses indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and plays a critical role in combustion, oxidation, and various chemical reactions.

Holmium Oxide Sputtering Target Specification

Material TypeHolmium Oxide
SymbolHo2O3
Color/AppearanceLight yellow
Melting Point (°C)2415
Density 3.79 g/cm3
Molecular Weight377.86
Exact Mass377.845 g/mol
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Holmium Oxide Sputtering Target Application

The Holmium Oxide Sputtering Target is utilized in a wide range of applications, including thin film deposition, decorative coatings, and the manufacture of semiconductors, displays, LEDs, and photovoltaic devices. Additionally, it plays a crucial role in functional coatings, the optical information storage industry, glass coatings for both automotive and architectural glass, and optical communication systems, among other fields.

Holmium Oxide Sputtering Target Packaging

Our Holmium Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take great care to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers Holmium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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