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(La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ Sputtering Target

Introduction

(La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ Sputtering Target is a multi-component rare-earth zirconate ceramic target developed for advanced functional coatings and research-driven thin film applications. By incorporating five rare-earth elements in an equimolar ratio, this complex oxide offers enhanced structural stability, tunable thermal properties, and compositional flexibility, making it especially attractive for next-generation thermal barrier coatings (TBCs), functional oxide films, and materials science research.

Detailed Description

This sputtering target is based on a high-entropy rare-earth zirconate composition, where La, Ce, Gd, Y, and Er jointly occupy the A-site of the zirconate lattice. Such compositional complexity can significantly improve phase stability, phonon scattering, and resistance to thermal degradation compared with conventional single- or binary-rare-earth zirconates.

The target is fabricated using carefully controlled powder synthesis, homogeneous mixing, and high-temperature sintering to achieve uniform elemental distribution and high density. Strict control of stoichiometry is essential, as even minor compositional deviations can influence lattice distortion, thermal conductivity, and film performance.

Targets can be supplied as unbonded ceramic discs for low-to-moderate power sputtering, or bonded to metallic backing plates (such as copper or titanium) to improve heat dissipation and mechanical stability during higher-power RF magnetron sputtering. The material is well suited for oxide deposition processes requiring precise composition transfer from target to film.

Applications

  • Thermal barrier coatings (TBCs) and advanced thermal management films

  • High-entropy oxide thin film research

  • Functional ceramic and dielectric coatings

  • Energy, aerospace, and high-temperature materials research

  • Academic and industrial thin film R&D

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical Formula(La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇Multi-component rare-earth zirconate
Purity99.9% – 99.99% (total)Affects phase stability & film quality
Target FormDisc / Plate (bonded or unbonded)Compatible with sputtering systems
Diameter25 – 300 mm (custom)Fits standard magnetron cathodes
Thickness3 – 6 mm (typical)Influences target lifetime
Sputtering ModeRF magnetron sputteringSuitable for insulating ceramics
Backing PlateCopper / Titanium (optional)Improves thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
(La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇High-entropy stability, low thermal conductivityAdvanced TBC & research films
Yttria-Stabilized Zirconia (YSZ)Mature, well-studiedConventional TBCs
Gd₂Zr₂O₇Low thermal conductivityNext-gen TBC research

FAQ

QuestionAnswer
Is this target suitable for RF sputtering?Yes, RF magnetron sputtering is recommended for this insulating ceramic.
Can the composition ratio be adjusted?Yes, rare-earth ratios can be customized for specific research needs.
Are bonded targets available?Yes, copper- or titanium-backed targets are available on request.
How is compositional uniformity ensured?Through controlled powder processing, mixing, and sintering.
Is a Certificate of Analysis provided?Yes, CoA is available upon request.

Packaging

Our (La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ Sputtering Targets are carefully labeled and vacuum-sealed or inert-gas packed to protect against contamination and moisture. Shock-absorbing materials and export-grade cartons or crates ensure safe transportation and storage.

Conclusion

(La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ Sputtering Target offers exceptional compositional stability, advanced thermal behavior, and high research value for complex oxide thin film deposition. With flexible customization, reliable quality control, and suitability for high-end RF sputtering applications, it is an ideal choice for cutting-edge ceramic and thermal barrier coating research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

(La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ target 99.95% ø50.8×3.18mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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