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ST0163C Lanthanum Strontium Manganate Sputtering Targets (La1-xSrxMnO3)

MSDS File
Material TypeLanthanum Strontium Manganate
SymbolLa(1-x)SrxMnO3, LSMO
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Relative Density (g/cc)6.5
Z RatioN/A
SputterRF, RF-R, DC
Max Power Density*
(Watts/Square Inch)		N/A
Type of BondIndium, Elastomer

More Information on Lanthanum Strontium Manganate Sputtering Targets

Applications

Lanthanum Strontium Manganate (LSMO) sputtering targets are designed for a wide range of cutting-edge applications, including:

  • Ferroelectric Materials
  • Gate Dielectrics
  • CMOS Devices

Features

  • High Purity: Manufactured with 99.9% purity to deliver consistent, high-performance thin films.
  • Custom Sizes Available: Targets can be tailored to meet your specific requirements, providing flexibility for diverse applications.

Manufacturing Process

  • Cold Pressing & Sintering: LSMO sputtering targets are made using cold pressing and sintering techniques for optimal material integrity and performance.
  • Elastomer Bonding: Elastomer bonding to the backing plate ensures excellent stability during sputtering.
  • Cleaning & Final Packaging: Targets are carefully cleaned for vacuum use and packaged to prevent contamination during transport.

Options Available

  • Purity: 99.9% minimum purity, ensuring high-quality sputtering results.
  • Smaller Sizes for R&D: Custom sizes are available, especially for research and development applications.
  • Sputtering Target Bonding Service: Bonding services are offered to further enhance target performance.

For further information or specific inquiries, feel free to reach out to us.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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