ST0873 Lithium Aluminum Germanium Phosphate Sputtering Target

Chemical Formula: LAGP
Catalog Number: ST0873
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Aluminum Germanium Phosphate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Lithium Aluminum Germanium Phosphate Sputtering Target Description

Lithium

Lithium Aluminum Germanium Phosphate Sputtering Target is a white sputtering material composed of lithium (Li), aluminum (Al), germanium (Ge), and phosphorus (P).

Lithium is a chemical element derived from the Greek word ‘lithos,’ meaning stone. First identified in 1817 by A. Arfwedson, its isolation was later achieved and announced by W. T. Brande. The chemical symbol for lithium is “Li,” and it has an atomic number of 3, located in Period 2, Group 1 of the periodic table, and belongs to the s-block. Its relative atomic mass is 6.941(2) Dalton, with the number in brackets indicating the uncertainty.

Related: Lithium Sputtering Target

Aluminum

Aluminum, or Aluminium, is a silvery-white, soft, non-magnetic, and ductile metal in the boron group. It constitutes about 8% of the Earth’s crust by mass, making it the third most abundant element after oxygen and silicon, and the most abundant metal in the crust. Despite its abundance, aluminum is less common in the Earth’s mantle. The primary ore of aluminum is bauxite. Due to its high reactivity, native aluminum is rare and found only in extreme reducing environments; it is typically found combined in over 270 different minerals.

Related: Aluminum Sputtering Target

GermaniumGermanium is a chemical element named after Germany, with its Latin name being *Germania*. It was first identified in 1886 by A. Winkler. The canonical chemical symbol for germanium is “Ge,” and its atomic number is 32. Located in Period 4 and Group 14 of the periodic table, germanium belongs to the p-block. Its relative atomic mass is 72.64(1) Dalton, with the number in brackets indicating the uncertainty.

Related: Germanium Sputtering Target

PhosphorusPhosphorus is a chemical element named after the Greek word “phosphoros,” meaning bringer of light. It was first mentioned in 1669 by H. Brand, who also accomplished its isolation. The canonical chemical symbol for phosphorus is “P.” Its atomic number is 15, and it is located in Period 3 and Group 15 of the periodic table, belonging to the p-block. The relative atomic mass of phosphorus is 30.973762(2) Dalton, with the number in brackets indicating the uncertainty.

Lithium Aluminum Germanium Phosphate Sputtering Target Specification

Material TypeLithium Aluminum Germanium Phosphate
SymbolLAGP
Color/AppearanceWhite Solid
Density3.42 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Aluminum Germanium Phosphate Sputtering Target Packing

Our Lithium Aluminum Germanium Phosphate sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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TFM offers Lithium Aluminum Germanium Phosphate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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