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Lithium Oxide Sputtering Targets

ST0913 Lithium Oxide Sputtering Targets, Li2O

Chemical FormulaLi2O
Catalog No.ST0913
CAS Number12057-24-8
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Lithium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Oxide Sputtering Targets Description

Lithium Oxide Sputtering Target is a specialized material used in the sputter deposition process, which is employed to deposit thin films onto substrates with high precision and control.

During sputtering, the Lithium Oxide Sputtering Target is bombarded with high-energy ions, leading to the ejection of atoms or molecules from the target material. These ejected particles then deposit onto a substrate, creating a thin film of lithium oxide. This process ensures the formation of a uniform and well-defined film layer.

Related Products: Lithium Chloride Sputtering Target, Lithium Borate Sputtering Target

Lithium Oxide Sputtering Targets Specifications

Compound FormulaLi2O
Molecular Weight29.88
AppearanceMetallic solid
Melting Point (℃)1570
Boiling Point (℃)N/A
Theoretical Density (g/cm3)2.013
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Lithium Oxide Sputtering Targets Application

Lithium Oxide Sputtering Target is suitable for applications in battery technology, fuel cells, and as a component in specific ceramics and glasses.

Lithium Oxide Sputtering Targets Packaging

Our Lithium Oxide Sputtering Targets are meticulously handled during storage and transportation to ensure they remain in pristine condition.

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TFM offers Lithium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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