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ST0982 Molybdenum Rhenium Sputtering Target, Mo-Re

Chemical FormulaMo-Re
Catalog No.ST0982
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum-Rhenium  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Rhenium Sputtering Target Description

Molybdenum-Rhenium sputtering targets are distinguished by their high melting points and excellent thermal stability, making them ideal for applications that require durability under high-temperature conditions. The combination of rhenium and molybdenum ensures these targets retain structural integrity even at elevated temperatures. Both metals are excellent conductors, which imparts superior properties to the targets for creating electronic and conductive films.

These targets are known for their high mechanical strength, offering exceptional wear and corrosion resistance, which is crucial in various industrial processes. Molybdenum-Rhenium sputtering targets find extensive use in optical coatings, electronic devices, and surface coatings, as well as in high-tech fields such as semiconductor manufacturing and optoelectronics.

Related Product: Rhenium Sputtering Target, Molybdenum Sputtering Target

Molybdenum Rhenium Sputtering Target Specifications

Compound FormulaMo-Re
AppearanceSilver Metallic Target
Melting Point2507℃
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Molybdenum Rhenium Sputtering Target Handling Notes

Indium bonding is recommended for Molybdenum-Rhenium sputtering targets because their properties, such as brittleness and low thermal conductivity, can affect sputtering performance. Due to their low thermal conductivity and susceptibility to thermal shock, indium bonding helps enhance the stability and effectiveness of these targets during the sputtering process.

Molybdenum Rhenium Sputtering Target Application

Optical Coatings: Molybdenum-Rhenium sputtering targets are essential for producing optical coatings that enhance surface optical properties. These coatings include anti-reflective layers, mirror coatings, and optical filters, improving performance in various optical applications.

Electronic Device Preparation: Thanks to the excellent conductivity of rhenium and molybdenum, these sputtering targets are crucial in the preparation of conductive films for electronic devices. They are used to create metal electrodes and connecting layers, which are integral to the functionality of electronic components.

Surface Coatings: Molybdenum-Rhenium targets are valuable for surface coating applications, where they enhance material hardness, wear resistance, and corrosion resistance. This improves the durability and performance of coated surfaces.

Semiconductor Manufacturing: In semiconductor manufacturing, Molybdenum-Rhenium sputtering targets are employed to deposit thin film layers, including metal and conductive layers, necessary for the fabrication of semiconductor devices.

Optoelectronics: These targets are used in optoelectronics to manufacture various devices and components, such as photodiodes and solar cells, supporting advancements in optoelectronic technologies.

Molybdenum Rhenium Sputtering Target Packaging

Our Molybdenum-Rhenium sputtering targets are meticulously managed throughout storage and transportation to ensure they retain their high quality and arrive in optimal condition.

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TFM’s Molybdenum-Rhenium sputtering targets are available in a variety of forms, purities, and sizes to suit a wide range of applications. We are dedicated to producing high-purity physical vapor deposition (PVD) materials with optimal density and minimal average grain sizes. These targets are ideal for use in semiconductor manufacturing, chemical vapor deposition (CVD), and PVD applications in display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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