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ST0100 Nickel Chromium Aluminum Sputtering Target, Ni/Cr/Al

Chemical Formula: Ni/Cr/Al
Catalog Number: ST0100
CAS Number: 7440-02-0 | 7440
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel Chromium Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Nickel Chromium Aluminum Sputtering Target Description

The Nickel Chromium Aluminum Sputtering Target from TFM is an alloy material composed of nickel (Ni), chromium (Cr), and aluminum (Al). This high-quality sputtering material is designed for applications that benefit from the combined properties of these three elements.

Nickel

Nickel, symbolized as “Ni,” is a chemical element whose name is derived from the shortened German term ‘kupfernickel,’ meaning either devil’s copper or St. Nicholas’s copper. It was first mentioned and observed by F. Cronstedt in 1751, who also accomplished its isolation. Nickel has an atomic number of 28 and is located in Period 4, Group 10 of the d-block in the periodic table. Its relative atomic mass is 58.6934(2) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Nickel Sputtering Target

Chromium

Chromium, symbolized as “Cr,” is a chemical element whose name originates from the Greek word ‘chroma,’ meaning color. Known and used since before 1 AD, it was notably discovered in connection with the Terracotta Army. Chromium has an atomic number of 24 and is located in Period 4, Group 6 of the d-block in the periodic table. Its relative atomic mass is 51.9961(6) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Chromium Sputtering Target

AluminumAluminium, also called aluminum, is a chemical element that originated from the Latin name for alum, ‘alumen’ meaningbitter salt. It was first mentioned in 1825 and observed by H.C.Ørsted. The isolation was later accomplished and announced by H.C.Ørsted. “Al” is the canonical chemical symbol of aluminium. Its atomic number in the periodic table of elements is 13 with a location at Period 3 and Group 13, belonging to the p-block. The relative atomic mass of aluminium is 26.9815386(8) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Aluminium Sputtering Target

Nickel Chromium Aluminum Sputtering Target Application

The Nickel Chromium Aluminum Sputtering Target is widely used for thin film deposition in various industries. Its applications include decoration, semiconductors, displays, LED and photovoltaic devices, and functional coatings. Additionally, it is utilized in the optical information storage industry, glass coating for car and architectural glass, optical communication, and other related fields.

Nickel Chromium Aluminum Sputtering Target Packing

Our Nickel Chromium Aluminum Sputtering Targets are meticulously handled to prevent any damage during storage and transportation. This careful handling ensures that our products maintain their original quality and arrive in perfect condition.

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TFM offers Nickel Chromium Aluminum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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