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ST0182 Praseodymium Oxide Sputtering Target, Pr6O11

Chemical Formula: Pr6O11
Catalog Number: ST0182
CAS Number: 12036-32-7
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Praseodymium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Praseodymium Oxide Sputtering Target Description

The Praseodymium Oxide Sputtering Target from TFM is a specialized oxide sputtering material composed of praseodymium (Pr) and oxygen (O). This material is commonly used in various thin film deposition processes, offering unique properties that are valuable in applications across industries such as electronics, optics, and more.

PraseodymiumPraseodymium is a chemical element named from the Greek ‘prasios didymos,’ which means green twin. It was first mentioned in 1885 and observed by the scientist A. von Welsbach. The chemical symbol for praseodymium is “Pr,” and it has an atomic number of 59. Praseodymium is located in Period 6, Group 3 of the periodic table, within the f-block. The relative atomic mass of praseodymium is 140.90765(2) Dalton, with the number in brackets indicating the uncertainty. This element is known for its use in various alloys, magnets, and in the production of specialized glass and ceramics.

Related Product: Praseodymium Sputtering Target

OxygenOxygen is a chemical element with the symbol “O,” originating from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first documented in 1771 and observed by Carl Wilhelm Scheele, who also accomplished its isolation. Oxygen’s atomic number is 8, placing it in Period 2 and Group 16 of the periodic table, within the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for life, playing a crucial role in respiration and combustion processes, and is a key component of water and many minerals.

Praseodymium Oxide Sputtering Target Specification

Compound FormulaPr6O11
Molecular Weight1021.44
AppearanceTarget
Melting Point2183 °C
Boiling Point3760 °C
Density6.5 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Praseodymium Oxide Sputtering Target Packaging

Our Praseodymium Oxide Sputtering Target is meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take great care in handling, storing, and transporting these targets to prevent any potential damage, preserving their integrity and quality throughout the process.

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TFM offers Praseodymium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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