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Scandium Aluminum Evaporation Materials

VD0645 Scandium Aluminum Evaporation Materials, Sc/Al

Catalog No.VD0645
MaterialScandium Aluminum (Sc/Al)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) excels as a top-tier producer and provider of high-purity scandium aluminum evaporation materials. We offer these materials in both powder and granule formats, with the flexibility to customize based on your specific requirements.

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Scandium Aluminum Evaporation Materials Description

Thin-Film Mat Engineering (TFM) offers high-purity scandium aluminum evaporation materials, an alloy featuring both scandium (Sc) and aluminum (Al). These materials are crucial for high-quality film deposition in various processes. Our scandium aluminum materials are available with a purity of up to 99.9995%, thanks to our stringent quality assurance practices that ensure exceptional reliability.

Related Product: Scandium Evaporation Materials,  Aluminum Evaporation Materials

Scandium-Metals-pellets Scandium-Metals-Lump scandium-aluminum-alloys

Scandium Aluminum Evaporation Materials Specification

Item No.DescriptionPurity (Sc/TREM)Lot Size
Sc/Al-VDScandium Aluminum (Sc/Al) Evaporation Materials

Pieces, Lump, Sublimed dendritic

2%Sc+98%Al1kg

10kg

100kg

Scandium Aluminum Evaporation Materials Application

Scandium aluminum evaporation materials are used in:

  • Deposition Processes: Including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applications such as wear protection, decorative coatings, and display technologies.

Scandium Aluminum Evaporation Materials Packaging

Our scandium aluminum evaporation materials are carefully tagged and labeled for clear identification and quality control. We ensure that the packaging protects the materials from damage during storage and transportation.

Get Contact

Thin-Film Mat Engineering (TFM) is a leading provider of high-purity scandium aluminum evaporation materials. We offer a variety of shapes, including tablets, granules, rods, and wires. Custom forms and quantities are available upon request. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and additional information, please contact us with your inquiry.

 

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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