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VD0574 Scandium Evaporation Materials, Sc

Material Type: Scandium
Symbol: Sc
Color/Appearance: Silvery White Metallic
Purity: 99.9% ~ 99.99%
Shape: Powder/ Granule/ Custom-made

TFM provides scandium evaporation materials in a range of forms, purities, sizes, and price points. We focus on producing high-purity e-beam evaporation materials, optimized for maximum density and minimal average grain sizes. For the latest pricing on evaporation pellets and other deposition materials not listed, please contact us directly.

MSDS File

Scandium Evaporation Material Description

Scandium (Sc), once considered a rare earth element alongside yttrium (Y) and the lanthanides (La), is a soft, silvery metal that can develop a yellowish or pinkish tint upon exposure to air due to oxidation.

High-purity scandium evaporation materials are essential for achieving high-quality films in deposition processes. TFM specializes in producing these materials with purities up to 99.99%, ensuring exceptional product reliability through rigorous quality assurance measures.

Scandium-Metals-pellets Scandium-Metals-Lump Scandium-Metals-Sublimed-dendritic

Scandium Evaporation Material Specification

Item No.DescriptionPurity (Sc/TREM)Lot Size
Sc-VD-3NScandium (Sc) Evaporation Materials

Pieces, Lump, Sublimed dendritic

99.9%100 g

500 g

1,000 g

Sc-VD-4NScandium (Sc) Evaporation Materials

Pieces, Lump, Sublimed dendritic

99.99%100 g

500 g

1,000 g

Sc-VD-4N5Scandium (Sc) Evaporation Materials

Pieces, Lump, Sublimed dendritic

99.995%100 g

500 g

1,000 g

Sc-VD-5NScandium (Sc) Evaporation Materials

Pieces, Lump, Sublimed dendritic

99.999%100 g

500 g

1,000 g

Scandium Evaporation Material Application

-PVD for Thin films Deposition

Scandium Evaporation Material Packaging

Scandium evaporation materials are meticulously tagged and labeled to ensure easy identification and effective quality control. We also handle these materials with care to prevent any damage during storage and transportation, preserving their quality throughout the process.

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TFM provides scandium evaporation materials in a range of forms, purities, sizes, and price points. We focus on producing high-purity e-beam evaporation materials, optimized for maximum density and minimal average grain sizes. For the latest pricing on evaporation pellets and other deposition materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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