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ST0987 Silicon Selenium Sputtering Target, Si-Se

Chemical FormulaSi-Se
Catalog No.ST0987
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM specializes in Silicon Selenium Sputtering Targets, maintaining a strong commitment to delivering exceptional quality while prioritizing cost-effectiveness. TFM’s dedication to superior standards ensures that clients receive top-tier sputtering targets, making them the preferred choice in the market without sacrificing affordability.

MSDS File

Silicon Selenium Sputtering Target Description

Silicon Selenide Sputtering Targets offer a range of unique properties that make them particularly valuable for optical and electronic applications. These targets facilitate precise thin-film deposition, ensuring high uniformity and accuracy in the production of optical coatings and electronic devices. As a result, Silicon Selenide Sputtering Targets are extensively used in the fabrication of optical components, optoelectronic devices, and advanced thin-film technologies. Additionally, their strong chemical stability allows them to perform reliably in complex manufacturing environments, making them a dependable material for high-tech industries.

Related Product: Aluminum Silicon Copper Sputtering Target, Aluminum Silicon Sputtering Target

Silicon Selenium Sputtering Target Specifications

Compound FormulaSi-Se
Molecular Weight107.045
AppearanceBlack Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Silicon Selenium Sputtering Target Handling Notes

Indium bonding is advised for Silicon Selenium Sputtering Targets because certain characteristics of this material make it less suitable for conventional sputtering methods. Due to its brittleness and low thermal conductivity, Silicon Selenium is prone to thermal shock, which can cause issues during the sputtering process. Indium bonding helps to address these challenges by providing a more stable and reliable attachment, ensuring consistent performance and durability of the sputtering targets under operational conditions.

Silicon Selenium Sputtering Target Application

Optical Coating Preparation: Silicon Selenide Sputtering Targets are commonly utilized in the creation of optical coatings, including reflective films, transparent conductive films, and optical filters. The material’s dark gray-to-black color, coupled with its excellent optical properties, makes it a preferred choice for enhancing the performance of optical components.

Optoelectronic Device Manufacturing: These targets are integral in producing optoelectronic devices such as lasers, photodetectors, and optical sensors. The precision offered by Silicon Selenide in thin film deposition is key to achieving the high performance required by these advanced technologies.

Thin Film Technology Applications: In the realm of thin film technology, Silicon Selenide Sputtering Targets are employed to coat electronic devices and other surfaces, thereby enhancing their optical properties and chemical stability, making them more resilient and effective in various applications.

Solar Cells: The unique properties of Si-Se films make them promising candidates for use in solar cells, where they can significantly improve light absorption and enhance the efficiency of electrical energy conversion.

Silicon Selenium Sputtering Target Packaging

Our Silicon Selenium Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.

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TFM’s Silicon Selenium Sputtering Target is offered in a range of forms, purities, and sizes to meet diverse application needs. We specialize in manufacturing high-purity physical vapor deposition (PVD) materials, ensuring maximum density and minimal average grain size. These targets are ideal for use in semiconductor production, chemical vapor deposition (CVD), and physical vapor deposition (PVD) for display and optical applications.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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