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ST0299 Tantalum Boride Sputtering Target, TaB2

Chemical Formula: TaB2
Catalog Number: ST0299
CAS Number: 12007-35-1
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum Boride (TaB2) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Tantalum Boride Sputtering Target Description

A Tantalum Boride Sputtering Target is a type of boride ceramic material composed of tantalum and boron, used in sputtering processes. This target is typically employed in thin film deposition and various specialized applications, leveraging the unique properties of the tantalum-boron combination.

TantalumTantalum is a chemical element named after King Tantalus, a character from Greek mythology and father of Niobe. It was first identified in 1802 by the Swedish chemist Anders Gustaf Ekeberg. The element is represented by the symbol “Ta” and has an atomic number of 73. Tantalum is located in Period 6 and Group 5 of the periodic table, belonging to the d-block elements. Its relative atomic mass is approximately 180.94788 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Tantalum Sputtering Target

BoronBoron is a chemical element with the symbol “B” and an atomic number of 5. Its name originates from the Arabic word ‘buraq,’ referring to borax. The element was first mentioned in 1808 by Louis-Joseph Gay-Lussac and Louis-Jacques Thénard, with its isolation later achieved and announced by Sir Humphry Davy. Boron is found in Period 2 and Group 13 of the periodic table, classified under the p-block elements. Its relative atomic mass is approximately 10.811 Daltons, with the number in parentheses indicating a margin of uncertainty.

Tantalum Boride Sputtering Target Application

The Tantalum Boride Sputtering Target is utilized in a wide range of applications, including thin film deposition and decorative coatings. It is widely employed in the semiconductor industry, display technologies, and the manufacturing of LEDs and photovoltaic devices. Additionally, this material is essential for functional coatings, the optical information storage industry, glass coating for automotive and architectural purposes, and optical communication technologies.

Tantalum Boride Sputtering Target Packing

Our Tantalum Boride (TaB2) Sputtering Targets are meticulously tagged and labeled on the exterior to ensure efficient identification and maintain stringent quality control. We take extensive precautions to protect these targets from any potential damage during storage and transportation, ensuring they arrive in optimal condition.

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TFM offers  Tantalum Boride (TaB2) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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