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ST0207 Zirconia Stabilized with Yttria Sputtering Target, ZrO2/Y2O3

Chemical Formula: ZrO2/Y2O3
Catalog Number: ST0207
CAS Number: 1314-36-9 | 1314
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconia Stabilized with Yttria sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconia Stabilized with Yttria Sputtering Target Description

Zirconia stabilized with yttria sputtering target, often referred to as YSZ (Yttria-Stabilized Zirconia), is an oxide sputtering material that combines zirconium dioxide (ZrO2) with yttrium oxide (Y2O3). This material is known for its exceptional ionic conductivity and is widely used in various high-temperature applications, including fuel cells, sensors, and thin-film coatings.

ZirconiumZirconium is a chemical element with the symbol “Zr,” derived from the Persian word ‘zargun,’ meaning gold-colored. This element was first identified in 1789 by H. Klaproth, and its isolation was later achieved by J. Berzelius. Zirconium has an atomic number of 40 and is located in Period 5, Group 4 of the periodic table, within the d-block. Its relative atomic mass is 91.224(2) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Zirconium Sputtering Target

YttriumYttrium is a chemical element with the symbol “Y,” named after Ytterby, Sweden, where it was first discovered. It was first noted in 1794 by J. Gadolin, and its isolation was later accomplished by G. Mosander. Yttrium is positioned in Period 5, Group 3 of the periodic table and belongs to the d-block. Its atomic number is 39, and the relative atomic mass of yttrium is 88.90585(2) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Yttrium Sputtering Target

OxygenOxygen is a chemical element with the symbol “O,” originating from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first noted in 1771 and observed by W. Scheele, who later accomplished and announced its isolation. Oxygen has an atomic number of 8 and is situated in Period 2, Group 16 of the periodic table, within the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, where the number in brackets indicates the uncertainty in this measurement.

Zirconia Stabilized with Yttria Sputtering Target Packaging

Our Zirconia Stabilized with Yttria Sputter Targets are meticulously handled to prevent any damage during storage and transportation, ensuring they remain in pristine condition. This careful handling preserves the quality and integrity of the products, guaranteeing they arrive at their destination ready for immediate use.

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TFM offers Zirconia Stabilized with Yttria Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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